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Contact

GRE North America

330 McEverRoad, Building 1

Suite 100, Gainsville, GA 40504

Tel: (770) 538-0630

sales@grena.org

GRE Hong Kong 

Unit 501, 5/F.

16 Science Park West Avenue

Phase 3, Hong Kong Science Park

Shatin, Hong Kong

Tel: (852) 2423-3332

GRE Japan

Level 21, Shiodome Shibarikyu Building 
1-2-3 Kaigan Minato-ku
Tokyo 105-0022 Japan

Tel: (81)-3-5403-6364

Printed Circuit Board Assembly

Our production facilities are equipped to provide turn-key printed circuit board assembly services. We offer both through-hole (THD) and surface mount technology (SMD) capabilities for various batch sizes, and our experienced teams across our Vietnam and China production sites will provide support services to enable professionally assembled PCB services at varying batch levels.

Production
  • ISO 9001/ISO 13485

  • Passive Parts 0402/ 01005(UK), 0.35mm pitch BGA

  • FR4, CEM1, CEM3, Phenolic, Polyimide, and Aluminum substrate PCBs

  • Minimum PCB Size: 25mmx25mm

  • Through-hole PCB

  • Auto-Insertion

  • Single / Double-sided

  • Wave Soldering

  • Potting/Conformal Coating

Testing
  • AOI

  • X-Ray

  • ICT

  • Functional Testing

  • Automated Burn-in

  • ATE

  • XRF for RoHS